IPC J-STD-033D pdf
IPC J-STD-033D pdf
IPC J-STD-033D pdf
IPC J-STD-033D pdf
IPC J-STD-033D pdf
  1. IPC J-STD-033D pdf
  2. IPC J-STD-033D pdf
  3. IPC J-STD-033D pdf
  4. IPC J-STD-033D pdf
  5. IPC J-STD-033D pdf

IPC J-STD-033D

Original price was: $101.00.Current price is: $50.00.

Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices

Association Connecting Electronics Industries , 03/01/2018

Category:
Guaranteed Safe Checkout
Standard By:Association Connecting Electronics Industries , 03/01/2018
Published:03/01/2018
Pages:32
File Size:1 file , 2.4 MB
Language:Chinese
Note:This product is unavailable in Russia, Ukraine, Belarus
IPC/JEDEC J-STD-033D provides surface mount device manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow sensitive components. These methods help avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation and damaged components. IPC/JEDEC J-STD-033D procedures provide a minimum shelf life of 12 months from the seal date when properly implemented. Developed by IPC and JEDEC.

Related products