THis standard establishes mechanical outline requirements for devices supplied in flip chip or CHip Size Package (CSP) formats. including die surface, die terminals, and interconnection balls/bumps/lands to the next level.
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IPC J-STD-027
Original price was: $101.00.$50.00Current price is: $50.00.
Mechanical Outline Standard for Flip Chip or Chip Scale Configurations
Association Connecting Electronics Industries , 02/01/2003
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