This document establishes the requirements and interactions necessary for printed board assembly processes for interconnecting high performance/high pin count IC packages. Includes information on design principles, material selection, board fabrication, assembly technology, testing strategy and reliability expectations based on end-use environments. Co-produced with EIA, MCNC and Sematech.
IPC J-STD-013
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Implementation of Ball Grid Array and Other High Density Technology
Association Connecting Electronics Industries , 08/01/1996
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