This standard prescribes general requirements for the characterization and testing of solder pastes used to make high quality electronic interconnections. This specification is a material quality control document and is not intended to relate directly to the material’s performance in the assembly process. Solder paste users are referred to paragraph 6.3 for a listing of requirements information and options that should be addressed when procuring solder paste.
IPC J-STD-005B
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Requirements for Soldering Pastes
Association Connecting Electronics Industries , 03/01/2024
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