This specification establishes a thermal cycling test method to characterize the fatigue lifetimes of surface mount solder attachments of electronic assemblies. The surface mount devices may be solder-attached to rigid, flexible or rigid-flex printed boards. The characterization results can be used to predict field lifetime of solder attachments for the use environments and conditions of electronic assemblies.
IPC 9701B
Original price was: $102.00.$51.00Current price is: $51.00.
Thermal Cycling Test Method for Fatigue Life Characterization of Surface Mount Attachments
Association Connecting Electronics Industries , 02/01/2022
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