This guideline covers the requirements for resin coated copper foil intended for use in the formation of high density interconnect surface microvias for printed boards and printed board assemblies.
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IPC 4563
Original price was: $101.00.$50.00Current price is: $50.00.
Resin Coated Copper Foil for Printed Boards Guideline
Association Connecting Electronics Industries , 11/01/2007
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