This guideline covers the requirements for resin coated copper foil intended for use in the formation of high density interconnect surface microvias for printed boards and printed board assemblies.
IPC 4563
Original price was: $101.00.$50.00Current price is: $50.00.
Resin Coated Copper Foil for Printed Boards Guideline
Association Connecting Electronics Industries , 11/01/2007
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