This standard establishes the requirements and other considerations (thermal, electrical, electromechanical and mechanical) for the design of Single Chip Module (SCM-L), MCM or MCM-L assemblies. Key concepts include adhesive interconnection information, typical die attach materials, microvia material properties, relationships with DFM and DFE.
IPC 2225
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Sectional Design Standard for Organic Multichip Modules (MCML & MCM-L Assemblies)
Association Connecting Electronics Industries , 05/01/1998
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