A standardized medium for developing reliability predictions of electronic systems and equipment.
To provide an approach for developing reliability predictions for electronic systems and equipment which will emphasize the physics-of-failure approach which (1) has models based on science/engineering first principles (2) has information on materials, architectures and operating stresses (3) considers all stresses, including steady state temperature, temperature rate of change and spatial temperature gradients as applicable to each root cause of failure mechanism.
New IEEE Standard – Superseded. The framework for the reliability prediction process for electronic systems and equipment, including hardware and software predictions at all levels, is covered.
To provide an approach for developing reliability predictions for electronic systems and equipment which will emphasize the physics-of-failure approach which (1) has models based on science/engineering first principles (2) has information on materials, architectures and operating stresses (3) considers all stresses, including steady state temperature, temperature rate of change and spatial temperature gradients as applicable to each root cause of failure mechanism.
New IEEE Standard – Superseded. The framework for the reliability prediction process for electronic systems and equipment, including hardware and software predictions at all levels, is covered.
