IEC 61188-6-3 Ed. 1.0 b:2024 pdf
IEC 61188-6-3 Ed. 1.0 b:2024 pdf
IEC 61188-6-3 Ed. 1.0 b:2024 pdf
IEC 61188-6-3 Ed. 1.0 b:2024 pdf
IEC 61188-6-3 Ed. 1.0 b:2024 pdf
  1. IEC 61188-6-3 Ed. 1.0 b:2024 pdf
  2. IEC 61188-6-3 Ed. 1.0 b:2024 pdf
  3. IEC 61188-6-3 Ed. 1.0 b:2024 pdf
  4. IEC 61188-6-3 Ed. 1.0 b:2024 pdf
  5. IEC 61188-6-3 Ed. 1.0 b:2024 pdf

IEC 61188-6-3 Ed. 1.0 b:2024

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Circuit boards and circuit board assemblies – Design and use – Part 6-3: Land pattern design – Description of land pattern for through hole components (THT)

International Electrotechnical Commission , 12/01/2024

Category:
Guaranteed Safe Checkout
Standard By:International Electrotechnical Commission , 12/01/2024
Published:12/01/2024
Pages:66
ISBN(s):9782832700693
File Size:1 file , 3.6 MB
Language:English, French
Note:This product is restricted and cannot be purchased in the following countries Ukraine, Russia, Belarus

This part of IEC 61188 specifies the requirements for lands and land pattern on circuit boards for the mounting of components with leads by soldering based on the solder joint requirements of IEC 61191-1 and IEC 61191-3.

This part of IEC 61188 specifies the requirements for soldering surfaces on circuit boards. This includes lands and land pattern for surface mounted components and also solderable hole configurations for through hole mounted components. These requirements are based on the solder joint requirements of IEC 61191-1, IEC 61191-2, IEC 61191-3 and IEC 61191-4.

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