1.1These test methods cover the testing of bonded mica splittings and bonded mica paper to be used for commutator insulation, hot molding, heater plates, and other similar insulating purposes.
1.2These test methods appear in the following sections:
Test Sections Compressive Creep 4 – 10 Dielectric Strength 38 – 41 Mica or Binder Content 19 Molding Test 31 – 36 Organic Binder 20 – 24 Resistivity 42 – 46 Silicone Binder 25 – 30 Stability Under Heat and Pressure 11 – 18
1.3The values stated in inch-pound units are to be regarded as standard. The values given in parentheses are mathematical conversions to SI units that are provided for information only and are not considered standard.
1.4This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety, health, and environmental practices and determine the applicability of regulatory limitations prior to use. See 40.1 and 45.1 for specific hazard statements.
1.5This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.
