1.1These test methods cover procedures for testing adhesives in liquid, highly viscous, solid, or set states, that are intended to be cured by electronic heating, or that are intended to provide electrical insulation, or that are intended for use in electrical apparatus.
1.2The procedures appear in the following order:
(1) Procedure for Testing Adhesives Before Use:
|
Section |
|
|
Power Factor and Dielectric Constant of Liquid Adhesives |
7 |
|
Direct-Current Conductivity |
8 |
|
Extract Conductivity |
9 |
|
Acidity and Alkalinity |
10 |
|
pH Value |
11 |
(2) Procedures for Testing Properties of Adhesives As Used:
|
Section |
|
|
Power Factor and Dielectric Constant of a Dried or Cured Adhesive Film |
12 |
|
Dielectric Strength |
13 |
|
Volume and Surface Resistivity |
14 |
|
Arc Resistance |
15 |
1.3This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety, health, and environmental practices and determine the applicability of regulatory limitations prior to use. For a specific hazard statement, see 8.2.
1.4This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.
